THS7319IZSVT

CLASSIFICATION

视频放大器和模块

manufacturer

Texas Instruments

type

IC AMP BUFFER 9UCSP

encapsulation

package

Tape & Reel (TR)

RoHS

YES

price

available options

price inquiry

inventory：1600

Not satisfied with the price? Please fill in the information and send the RFQ quickly below. We will respond immediately

Quick inquiry

specifications

Part Status

Obsolete

Mounting Type

Surface Mount

Number of Circuits

Output Type

Rail-to-Rail

Current - Output / Channel

70 mA

Slew Rate

80V/µs

Applications

Buffer

-3db Bandwidth

20 MHz

Voltage - Supply, Single/Dual (±)

2.5V ~ 5.5V

Current - Supply

3.4 mA

Package / Case

9-XFBGA, CSPBGA

Supplier Device Package

9-UCSP (1.5x1.5)